三星电子设备解决方案DS)部门已着手开发下一代封装材料“玻璃中介层”,目标不仅是取代昂贵的硅中介层,还要提升芯片性能。据报导,三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt
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